This is the amazing flattened bead type of our thermocouple for the ultimate response and accuracy. This incredibly accurate TC will minimise the risk of overheating your precious PCB/BGA during reflowing and reduce heat damage. Our extensive in-house testing with reworking machines be it hot air or dark IR or light IR, has shown that the middle part of the targeted device (the BGA) receives the highest IR radiation or convection hot-air. As a result it is possible to damage the device if the thermocouple is placed some distance away from the centre of the target device.
We are developing a high conductivity thermal putty to be able to place the TC where it should be placed in the middle of the targeted device, to avoid thermal damage to the PCB or the BGA. Using high temperature Kapton or the putty that is being developed would be the best method for accurate temperatures. We have been taking data using the excellent Pico Technology TC08 USB Thermocouple logger and our datalogs confirm there is a substantial difference between the centre of the BGA and the temperature within 5mm of the surrounding area of the BGA. Our advice is to use more bottom heating at a slower rate when ramping up from 150deg C to 180degC during the soak stage using the lowest heat setting for the bottom heater, which will allow enough time for the PCB to be evenly heated especially around the BGA area.
The reflow stage that follows will provide a quality reflow due to the evenly heated PCB and the melting process of the solder balls will be better than ever. The recommended reflow temperatures should be observed and dwell at the maximum tempearture should be limited to about 10 seconds at most. You will soon be trusting your temperature readings with our flattened bead TC.
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