Description

Our low melting point T3 (25-45 micrometer) particle size solder paste. This is a no-clean product and is lead free. This product can be used in place of Chipquick at a much lower cost.

Money back guarantee, it will out-perform similar products!

You can now remove leaded ICs at temperatures below 183 deg C. Otherwise it would be necessary to exceed 225 deg C to remove the IC without our low melt solder paste or Chipquick.